PGA to Surface Mount Foot Print, Test Head

Interconnect Systems Inc.

Architecture:
Type :
Last Update:

i960(R) Processors KX
Hardware Accessories
6/26/97 11:30:00 AM

Vendor Information

Tool Description:

Interconnect Systems, Inc. has developed a PGA to QFP adapter mechanism ("Emulator Test Head") which allows users of Intel i960(R) processors to probe directly to the bare SMT footprint on their board assembly, thus solving a major test issue for high-end chip users contemplating the transition to a QFP package from a PGA package.

Tool Features:

Probes Directly to Fine-Pitch SMT Pads on Chip-Users Circuit Board

Non-Permanent Connection to SMT Pads

Pin-Compatible With Existing PGA Test Set-Ups

Development Platform(s):

File Attachments:

S960_157.PDF - Solutions960(R) Catalog Product Listing

Supported Device Detail Matrix:

Part & Package
Availability

80960KA - 132ldPGA
80960KA - 132ldPQFP
80960KB - 132ldPGA
80960KB - 132ldPQFP
82961KD - 132ldPQFP
82961KD - 164ldPQFP
NOW
NOW
NOW
NOW
NOW
NOW

Vendor Information:

Interconnect Systems Inc.

2162 Union Place, P.O. Box 1089
Simi Valley , CA 93065
USA
(805) 581-5626

Fax : (805) 581-5032

Contact the vendor above for the latest Distributor information

	Part & Package		Availability
	80960KA - 132ldPGA 80960KA - 132ldPQFP 80960KB - 132ldPGA 80960KB - 132ldPQFP 82961KD - 132ldPQFP 82961KD - 164ldPQFP		NOW NOW NOW NOW NOW NOW